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MMIC and Module Solutions in Low Profile Packages
Features
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> Low Insertion Loss : SP7T 0.4 dB typ. at UMTS Tx
> Low IM3 : SP7T -105 dBm typ.
> Low Profile Module : h=0.85 mm
> Integrated PHEMT Logic and Robust Planar Passives
> Eudyna PHEMT Technology Optimized for Switch |
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Mobile Phone  High Power Handling with Integrated Logic Circuit, Low Profile Pkg with LPF or Diplexer
| Part Number |
Type |
Frequency
(GHz) |
P0.1dB
(dBm) |
Outline/
Package Code |
Application |
| FMM5320ZW
* |
SPDT |
0.1~2.0 |
36 |
SC70 (SOT363) |
GSM, CDMA |
| FMM5309ZU |
SP3T |
0.1~2.0 |
36 |
QFN12 3×3mm |
GSM, CDMA |
| FMM5321ZV |
SP6T+logic+LPF |
0.1~2.0 |
36 |
QFN24 4×4mm |
Quad GSM |
| HS/M59SP7T424 * |
SP7T+logic+LPF |
0.1~2.2 |
36 |
QFN24 4×4mm |
GSM, UMTS |
| HS/M60SP8T424 * |
SP8T+logic+Dip |
0.1~2.2 |
36 |
QFN24 4×4mm |
GSM, UMTS |
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| WLAN / WiMAX Low Loss, Low Profile, and Low Cost |
| Part Number |
Type |
Frequency
(GHz) |
P0.1dB
(dBm) |
Outline/
Package Code |
Application |
| FMM5317ZW |
SPDT |
0.1~4.0 |
34 |
SC70 (SOT363) |
WLAN 11b/g, WiMAX |
| ES/EMM5326ZW* |
SPDT |
0.1~3.5 |
29 |
SC70 (SOT363) |
WLAN 11b/g |
| ES/EMM5328ZW* |
SPDT |
0.1~6.0 |
29 |
SC70 (SOT363) |
WLAN 11a/b/g |
| EMM5329ZW |
SPDT |
0.1~6.0 |
33 |
SC70 (SOT363) |
WLAN 11a/b/g |
| HS/M67SPDTX * |
SPDT |
0.1~6.0 |
29 |
Bare Die |
WLAN 11a/b/g |
| HS/M67SP3TX * |
SP3T |
0.1~6.0 |
31 |
Bare Die |
WLAN 11a/b/g |
| HS/M67DPDTXB * |
DPDT |
0.1~6.0 |
31 |
Bare Die |
WLAN 11a/b/g |
*: Under Development
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